Continuous developments and implementation of new technologies such as organic-substrate-interposer technology and silicon-via-interconnection technology in the semiconductor assembly & testing services market are creating significant revenue opportunities for players in the semiconductor assembly and testing services market. Implementation of semiconductor assembly and testing services in the consumer electronics sector helps manufacturers produce semiconductors, memory chips, and wafers used in consumer electronic products and wireless/mobile handsets in a more efficient manner.
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The value of the global semiconductor assembly and testing services market is anticipated to witness a CAGR of 5.8% during the forecast period of 2019-2029.
Key Takeaways of Semiconductor Assembly and Testing Services Market Study
- Among the application segment, consumer electronics segment is expected to witness high growth rate, owing to rising demand for audio/video equipment, cameras, calculators, and smart homes (home safety equipment & accessories)
- Asia Pacific Excluding Japan is expected to create lucrative growth opportunities for players in the semiconductor assembly and testing services market, attributable to rapid growth of packaging of semiconductors, and increasing applications of semiconductor assembly methodologies in this region
- Increasing demand for connected devices worldwide including smartphones and tablets having connectivity and multimedia capabilities propels demand for higher packaging technologies and creates growth opportunities for service provider in the semiconductor assembly and testing services market.
“Semiconductor assembly and testing service providers can improve revenues by upgrading existing facilities to include superior electrical and thermal performance, and high input and output capabilities,” Says the FMI Analyst
Gains Upheld by Increasing Demand for Improved Connectivity in Consumer Electronics
Higher demand for mobile and connected devices such as tablets and smartphones, has bolstered the demand for higher packaging technologies. Also, rising demand for digital video content drives growth of high performance and mobile consumer electronics products, such as Wi-Fi chipsets and other semiconductor chips. For instance, STATS chipPAC (JCET) develops expanded Wafer Level Chip Scale Package (eWLCSP), which offers improved testing and a low cost fan-in wafer level package for space-controlled mobile devices.
Moreover, growth of end-use industries such as electronics and semiconductors, automotive, manufacturing, and packaging is expected to offer potential growth opportunities for manufacturers in the global semiconductor assembly and testing services market.
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ODMs and OEMS to Prioritize ‘Fab-lite’ Strategy
As semiconductor process technology migrates to larger wafers and smaller feature sizes, cost of building state-of-the-art wafer fabrication factories has risen significantly, reaching several billion dollars. High investment costs for next generation silicon technology and equipment are influencing various semiconductor companies to adopt or maintain a ‘fabless’ or ‘fab-lite’ strategy. The increasing demand for semiconductors are needed for cloud integration and connectivity with including sensors, computing, interactivity and communication devices.
More Valuable Insights on Semiconductor Assembly and Testing Services Market
FMI’s report on the semiconductor assembly and testing services market is segmented into three major sections such as services (assembly & packaging services (copper wire & gold wire bonding, flip chip, wafer level packaging, TSV, others), and testing services), applications (communications, computing & networking, consumer electronics, industrial and automotive electronics, and region to help readers understand and lucrative evaluate opportunities in the semiconductor assembly and testing services market.
What are the future prospects of semiconductor assembly and testing services market?
The development of new semiconductor assembly and testing technologies such as wafer-level packaging (WLP) interconnecting technology and organic-substrate-interposer technology, etc. These technologies find application in various 3D packages, 3D integrated circuits, and image sensors due to their attributes such as low cost, improved test times, and scalability.
What are the major challenges for semiconductor assembly and testing services market?
A high capital requirement for high-end packaging solutions and market instability, which is a major challenge for the Semiconductor Assembly and Testing Services market.
Which industry will have significant revenue growth in the next five years?
The communications industry has been considered as largest revenue growth in the next five years due to semiconductor assembly and testing service providers have wider capability of offering additional features such as miniaturization, additional functionality, low power consumption, and improved thermal and electrical performance for communication industry. This is projected to offer significant growth opportunities for market players during the forecast period.
What are the major opportunities for semiconductor assembly and testing services market?
Increasing demand for mobility and connectivity in consumer electronic products and increasing use of safety systems in automobile industry, which is a major opportunities for the semiconductor assembly and testing services market
Which region is expected to be at forefront in the semiconductor assembly and testing services market?
Owing to significant demand for 3D packaging solutions environments from testing and packaging sectors, Asia Pacific excluding Japan is expected to remain at forefront of high growth opportunities. The demand for efficient technology for advanced packaging is expected to increase in the region, thereby providing lucrative opportunities for leading market players.
Who are the major companies leading semiconductor assembly and testing services market?
Prominent companies in the semiconductor assembly and testing services market includes ASE Group, Inc., Amkor Technology, Inc., Siliconware Precision Industries Co., Ltd, Powertech Technology, Inc., United Test and Assembly Center Ltd., JCET Group Co Ltd, Chipbond Technology Corporation., Global Foundries Inc., CORWIL Technology Corp., and among others.
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