Semiconductor Assembly And Testing Services Market 2021 | Present Scenario and Growth Prospects 2027

Continuous developments and implementation of new technologies such as organic-substrate-interposer technology and silicon-via-interconnection technology in the semiconductor assembly & testing services market are creating significant revenue opportunities for players in the semiconductor assembly and testing services market. Implementation of semiconductor assembly and testing services in the consumer electronics sector helps manufacturers produce semiconductors, memory chips, and wafers used in consumer electronic products and wireless/mobile handsets in a more efficient manner.

The value of the global semiconductor assembly and testing services market is anticipated to witness a CAGR of 5.8% during the forecast period of 2019-2029.

The consumer electronics segment is expected to lead the global market with a high market valuation during the forecast period, due to several factors such as growing penetration of smartphones and solid-state drives (SSDs), and increasing adoption of semiconductor assembly & testing services to meet customer expectations.

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Semiconductor industry is highly volatile in nature. Major value market participants in this industry are fabless companies that focus on leveraging their resources in designing and utilizing their expertise in enhancing performance of the chipsets or ICs. Therefore, most of the semiconductor assembly, testing, and packaging related services are outsourced by fabless companies to third party providers known as ‘Outsourced Semiconductor Assembly and Test Service Providers’.

semiconductor assembly and testing services sats market share by region

Semiconductor Assembly and Testing Services Market: Segmentation

The global semiconductor assembly and testing services market is segmented in detail to cover every aspect of the market and present a complete market intelligence approach to readers.

By Services

  • Assembly & Packaging Services
    • Copper Wire & Gold Wire Bonding
    • Flip Chip
    • Wafer Level Packaging
    • TSV
    • Others
  • Testing Services

Applications  

  • Communications
  • Computing & Networking
  • Consumer Electronics
  • Industrial
  • Automotive Electronics

Region

  • North America
  • Latin America
  • Western Europe
  • Eastern Europe
  • Asia Pacific excluding Japan
  • Japan
  • Middle East & Africa

 

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Frequently Asked Questions about Semiconductor Assembly and Testing Services Market

What are the future prospects of semiconductor assembly and testing services market?

The development of new semiconductor assembly and testing technologies such as wafer-level packaging (WLP) interconnecting technology and organic-substrate-interposer technology, etc. These technologies find application in various 3D packages, 3D integrated circuits, and image sensors due to their attributes such as low cost, improved test times, and scalability.

What are the major challenges for semiconductor assembly and testing services market?

A high capital requirement for high-end packaging solutions and market instability, which is a major challenge for the Semiconductor Assembly and Testing Services market.

Which industry will have significant revenue growth in the next five years?

The communications industry has been considered as largest revenue growth in the next five years due to semiconductor assembly and testing service providers have wider capability of offering additional features such as miniaturization, additional functionality, low power consumption, and improved thermal and electrical performance for communication industry. This is projected to offer significant growth opportunities for market players during the forecast period.

What are the major opportunities for semiconductor assembly and testing services market?

Increasing demand for mobility and connectivity in consumer electronic products and increasing use of safety systems in automobile industry, which is a major opportunities for the semiconductor assembly and testing services market

Which region is expected to be at forefront in the semiconductor assembly and testing services market?

Owing to significant demand for 3D packaging solutions environments from testing and packaging sectors, Asia Pacific excluding Japan is expected to remain at forefront of high growth opportunities. The demand for efficient technology for advanced packaging is expected to increase in the region, thereby providing lucrative opportunities for leading market players.

Who are the major companies leading semiconductor assembly and testing services market?

Prominent companies in the semiconductor assembly and testing services market includes ASE Group, Inc., Amkor Technology, Inc., Siliconware Precision Industries Co., Ltd, Powertech Technology, Inc., United Test and Assembly Center Ltd., JCET Group Co Ltd, Chipbond Technology Corporation., Global Foundries Inc., CORWIL Technology Corp., and among others.

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